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 H7N1005LD, H7N1005LS, H7N1005LM
Silicon N Channel MOS FET High Speed Power Switching
REJ03G0391-0200 Rev.2.00 Oct 16, 2006
Features
* Low on-resistance RDS (on) = 85 m typ. * Low drive current * Capable of 4.5 V gate drive
Outline
RENESAS Package code: PRSS0004AE-A (Package name: LDPAK (L) )
4 4 1. Gate 2. Drain 3. Source 4. Drain 2 3
RENESAS Package code: PRSS0004AE-B (Package name: LDPAK (S)-(1) )
1 1 2 3
H7N1005LD
H7N1005LS
RENESAS Package code: PRSS0004AE-C (Package name: LDPAK (S)-(2) )
4 G
D
1
2
3
S
H7N1005LM
Rev.2.00 Oct 16, 2006 page 1 of 8
H7N1005LD, H7N1005LS, H7N1005LM
Absolute Maximum Ratings
(Ta = 25C)
Item Drain to source voltage Gate to source voltage Drain current Drain peak current Body to drain diode reverse drain current Avalanche current Avalanche energy Channel dissipation Channel temperature Storage temperature Notes: 1. PW 10 s, duty cycle 1% 2. Value at Tc = 25C 3. Value at Tch = 25C, Rg 50 Symbol VDSS VGSS ID ID (pulse) Note 1 IDR IAP Note 3 EAR Note 3 Pch Note 2 Tch Tstg Value 100 20 15 30 30 8 6.4 30 150 -55 to +150 Unit V V A A A A mJ W C C
Electrical Characteristics
(Ta = 25C)
Item Drain to source breakdown voltage Gate to source breakdown voltage Gate to source leak current Zero gate voltage drain current Gate to source cutoff voltage Static drain to source on state resistance Forward transfer admittance Input capacitance Output capacitance Reverse transfer capacitance Total gate charge Gate to source charge Gate to drain charge Turn-on delay time Rise time Turn-off delay time Fall time Body to drain diode forward voltage Body to drain diode reverse recovery time Note: 4. Pulse test Symbol V (BR) DSS V (BR) GSS IGSS IDSS VGS (off) RDS (on) |yfs| Ciss Coss Crss Qg Qgs Qgd td (on) tr td (off) tf VDF trr Min 100 20 -- -- 1.5 -- -- 6.5 -- -- -- -- -- -- -- -- -- -- -- -- Typ -- -- -- -- -- 85 105 11 830 90 55 15 3 4 15 85 42 6.8 0.93 41 Max -- -- 10 10 2.5 110 155 -- -- -- -- -- -- -- -- -- -- -- -- -- Unit V V A A V m m S pF pF pF nC nC nC ns ns ns ns V ns Test Conditions ID = 10 mA, VGS = 0 IG = 100 A, VDS = 0 VGS = 16 V, VDS = 0 VDS = 100 V, VGS = 0 ID = 1 mA, VDS = 10 V Note 4 ID = 7.5 A, VGS = 10 V Note 4 ID = 7.5 A, VGS = 4.5 V Note 4 ID = 7.5 A, VGS = 10 V Note 4 VDS = 10 V VGS = 0 f = 1 MHz VDD = 50 V VGS = 10 V ID = 15 A VGS = 10 V, ID = 7.5 A RL = 4 Rg = 4.7 IF = 15 A, VGS = 0 IF = 15 A, VGS = 0 diF/dt = 100 A/s
Rev.2.00 Oct 16, 2006 page 2 of 8
H7N1005LD, H7N1005LS, H7N1005LM
Main Characteristics
Power vs. Temperature Derating
50 100
Maximum Safe Operation Area
Pch (W)
(A)
40
1
10
m
s
10
10
0 s
s
Channel Dissipation
30
ID
Drain Current
1
DC Operation (Tc = 25C)
20
10
PW = 10 ms Operation in (1shot) this area is 0.1 limited by RDS (on) Ta = 25C 0.01 0.1 0.3 1
0
0
50
100
150
200
3
10
30
100 300
Case Temperature
Tc (C)
Drain to Source Voltage
VDS (V)
Typical Output Characteristics
20 10 V 8V 6V 5V Pulse Test 20
Typical Transfer Characteristics
VDS = 10 V Pulse Test
ID (A)
16
ID (A) Drain Current
4.5 V
15
12
4V 10
Drain Current
8 3.5 V 4 VGS = 3 V 0 0 2 4 6 8 10
5
Tc = 75C 25C -25C
0 0 1 2 3 4 5 6
Drain to Source Voltage
VDS (V)
Gate to Source Voltage
VGS (V)
Drain to Source Saturation Voltage vs. Gate to Source Voltage
Static Drain to Source on State Resistance vs. Drain Current
Drain to Source Saturation Voltage VDS(on) (V)
2.0
Drain to Source On State Resistance RDS(on) (m)
Pulse Test
1000 500
Pulse Test
1.5
200 VGS = 4.5 V 100 10 V 50
1.0
ID = 10 A
0.5
5A 2A
20 10 1 2 5 10 20 50 100
0 0 4 8 12 16 20
Gate to Source Voltage
VGS (V)
Drain Current
ID (A)
Rev.2.00 Oct 16, 2006 page 3 of 8
H7N1005LD, H7N1005LS, H7N1005LM
Static Drain to Source on State Resistance vs. Temperature
Forward Transfer Admittance |yfs| (S)
500 100 30 10 3 1 0.3 0.1 0.03 0.01 0.01 0.03 0.1 0.3 1 3 VDS = 10 V Pulse Test 10 30 100 25C 75C Tc = -25C Pulse Test
Static Drain to Source on State Resistance RDS(on) (m)
Forward Transfer Admittance vs. Drain Current
400
300 ID = 2 A, 5 A 200 VGS = 4.5 V 100 10 V 0 -25 0 25 50
10 A
2 A, 5 A 75
10 A
100 125 150
Case Temperature
Tc
(C)
Drain Current ID (A) Typical Capacitance vs. Drain to Source Voltage
10000 3000 1000 300 100 30 10 Coss Crss Ciss VGS = 0 f = 1 MHz
Body to Drain Diode Reverse Recovery Time
Reverse Recovery Time trr (ns)
100
50
20 di / dt = 100 A / s VGS = 0, Ta = 25C 10 0.1 0.2 0.5 1 2 5 10 20
Capacitance C (pF)
0
10
20
30
40
50
Reverse Drain Current
IDR (A)
Drain to Source Voltage VDS (V)
Dynamic Input Characteristics
(V) VGS (V)
200 ID = 12 A 160 VGS 120 VDS VDD = 25 V 50 V 100 V 12 16 20 1000
Switching Characteristics
VGS = 10 V, VDD = 30 V PW = 5 s, duty 1 % 300 Rg = 4.7 100 30 10 3 1 0.1 tr tf td(off) td(on)
VDS
Drain to Source Voltage
80
8
40
VDD = 100 V 50 V 25 V 0 4 8 12 16 20
4
0
0
Gate to Source Voltage
Switching Time t (ns)
0.3
1
3
10
30
100
Gate Charge
Qg (nc)
Drain Current
ID (A)
Rev.2.00 Oct 16, 2006 page 4 of 8
H7N1005LD, H7N1005LS, H7N1005LM
Reverse Drain Current vs. Source to Drain Voltage
Repetitive Avalanche Energy EAR (mJ) (A)
20 10 V 16 8 7 6 5 4 3 2 1 0 25 50 75 100 125 150 IAP = 8 A VDD = 50 V duty < 0.1 % Rg 50
Maximum Avalanche Energy vs. Channel Temperature Derating
Reverse Drain Current
IDR
12
8 VGS = 0, -5 V 5V 0 0 0.4 0.8 1.2 Pulse Test 1.6 2.0
4
Source to Drain Voltage
VSD (V)
Channel Temperature Tch (C)
Normalized Transient Thermal Impedance vs. Pulse Width
Normalized Transient Thermal Impedance s (t)
3 Tc = 25C D=1 1 0.5 0.3
0.2
0.1
0.05
ch - c (t) = s (t) * ch - c
0.0 .01 2
0.1
0
ch - c = 4.17C/W, Tc = 25C PDM PW T
0.03
1s
t ho
pu
lse
D=
PW T
0.01 10
100
1m
10 m
100 m
1
10
Pulse Width PW (S)
Avalanche Test Circuit
Avalanche Waveform 1 * L * IAP2 * 2 VDSS VDSS - VDD
V(BR)DSS IAP VDD ID VDS
VDS Monitor
L IAP Monitor
EAR =
Rg
D.U.T
Vin 15 V
50 VDD
0
Rev.2.00 Oct 16, 2006 page 5 of 8
H7N1005LD, H7N1005LS, H7N1005LM
Switching Time Test Circuit Waveform
Vin Monitor D.U.T. Rg RL
Vout Monitor Vin Vout 10% 10%
90%
10%
Vin 10 V
VDS = 30 V td(on)
90% tr
90% td(off) tf
Rev.2.00 Oct 16, 2006 page 6 of 8
H7N1005LD, H7N1005LS, H7N1005LM
Package Dimensions
Package Name LDPAK(L) JEITA Package Code RENESAS Code PRSS0004AE-A Previous Code LDPAK(L) / LDPAK(L)V MASS[Typ.] 1.40g
Unit: mm
(1.4)
4.44 0.2 10.2 0.3 1.3 0.15
11.3 0.5 0.3 10.0 + 0.5 -
8.6 0.3
1.3 0.2 1.37 0.2
0.76 0.1 2.54 0.5 2.54 0.5
11.0 0.5
0.2 0.86 + 0.1 -
2.49 0.2
0.4 0.1
Package Name LDPAK(S)-(1)
JEITA Package Code SC-83
RENESAS Code PRSS0004AE-B
Previous Code LDPAK(S)-(1) / LDPAK(S)-(1)V
MASS[Typ.] 1.30g
Unit: mm
4.44 0.2 10.2 0.3
(1.4)
8.6 0.3
+ 0.3 - 0.5
10.0
(1.5)
(1.5)
2.49 0.2 0.2 0.1 + 0.1 -
7.8 7.0
2.2
1.37 0.2 1.3 0.2 2.54 0.5
0.3 3.0 + 0.5 -
0.2 0.86 + 0.1 -
0.4 0.1
2.54 0.5
Rev.2.00 Oct 16, 2006 page 7 of 8
1.7
1.3 0.15
7.8 6.6
H7N1005LD, H7N1005LS, H7N1005LM
Package Name LDPAK(S)-(2) JEITA Package Code RENESAS Code PRSS0004AE-C Previous Code LDPAK(S)-(2) / LDPAK(S)-(2)V MASS[Typ.] 1.35g
Unit: mm
4.44 0.2 10.2 0.3
(1.4)
8.6 0.3
+ 0.3 - 0.5
2.49 0.2
10.0
(1.5)
(2.3)
0.2 0.1 + 0.1 -
7.8 7.0
2.2
1.37 0.2 1.3 0.2 2.54 0.5 0.4 0.1
0.3 5.0 + 0.5 -
0.2 0.86 + 0.1 -
2.54 0.5
Ordering Information
Part Name H7N1005LD-E H7N1005LSTL-E H7N1005LMTL-E Quantity 500 pcs 1000 pcs 1000 pcs Shipping Container Box (Conductive Sack) Taping Taping
Note: For some grades, production may be terminated. Please contact the Renesas sales office to check the state of production before ordering the product.
Rev.2.00 Oct 16, 2006 page 8 of 8
1.7
1.3 0.15
7.8 6.6
Sales Strategic Planning Div.
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
Notes: 1. This document is provided for reference purposes only so that Renesas customers may select the appropriate Renesas products for their use. Renesas neither makes warranties or representations with respect to the accuracy or completeness of the information contained in this document nor grants any license to any intellectual property rights or any other rights of Renesas or any third party with respect to the information in this document. 2. Renesas shall have no liability for damages or infringement of any intellectual property or other rights arising out of the use of any information in this document, including, but not limited to, product data, diagrams, charts, programs, algorithms, and application circuit examples. 3. You should not use the products or the technology described in this document for the purpose of military applications such as the development of weapons of mass destruction or for the purpose of any other military use. When exporting the products or technology described herein, you should follow the applicable export control laws and regulations, and procedures required by such laws and regulations. 4. All information included in this document such as product data, diagrams, charts, programs, algorithms, and application circuit examples, is current as of the date this document is issued. Such information, however, is subject to change without any prior notice. Before purchasing or using any Renesas products listed in this document, please confirm the latest product information with a Renesas sales office. Also, please pay regular and careful attention to additional and different information to be disclosed by Renesas such as that disclosed through our website. (http://www.renesas.com ) 5. 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With the exception of products specified by Renesas as suitable for automobile applications, Renesas products are not designed, manufactured or tested for applications or otherwise in systems the failure or malfunction of which may cause a direct threat to human life or create a risk of human injury or which require especially high quality and reliability such as safety systems, or equipment or systems for transportation and traffic, healthcare, combustion control, aerospace and aeronautics, nuclear power, or undersea communication transmission. If you are considering the use of our products for such purposes, please contact a Renesas sales office beforehand. Renesas shall have no liability for damages arising out of the uses set forth above. 8. Notwithstanding the preceding paragraph, you should not use Renesas products for the purposes listed below: (1) artificial life support devices or systems (2) surgical implantations (3) healthcare intervention (e.g., excision, administration of medication, etc.) (4) any other purposes that pose a direct threat to human life Renesas shall have no liability for damages arising out of the uses set forth in the above and purchasers who elect to use Renesas products in any of the foregoing applications shall indemnify and hold harmless Renesas Technology Corp., its affiliated companies and their officers, directors, and employees against any and all damages arising out of such applications. 9. You should use the products described herein within the range specified by Renesas, especially with respect to the maximum rating, operating supply voltage range, movement power voltage range, heat radiation characteristics, installation and other product characteristics. Renesas shall have no liability for malfunctions or damages arising out of the use of Renesas products beyond such specified ranges. 10. Although Renesas endeavors to improve the quality and reliability of its products, IC products have specific characteristics such as the occurrence of failure at a certain rate and malfunctions under certain use conditions. Please be sure to implement safety measures to guard against the possibility of physical injury, and injury or damage caused by fire in the event of the failure of a Renesas product, such as safety design for hardware and software including but not limited to redundancy, fire control and malfunction prevention, appropriate treatment for aging degradation or any other applicable measures. Among others, since the evaluation of microcomputer software alone is very difficult, please evaluate the safety of the final products or system manufactured by you. 11. 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Refer to "http://www.renesas.com/en/network" for the latest and detailed information. Renesas Technology America, Inc. 450 Holger Way, San Jose, CA 95134-1368, U.S.A Tel: <1> (408) 382-7500, Fax: <1> (408) 382-7501 Renesas Technology Europe Limited Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K. Tel: <44> (1628) 585-100, Fax: <44> (1628) 585-900 Renesas Technology (Shanghai) Co., Ltd. Unit 204, 205, AZIACenter, No.1233 Lujiazui Ring Rd, Pudong District, Shanghai, China 200120 Tel: <86> (21) 5877-1818, Fax: <86> (21) 6887-7898 Renesas Technology Hong Kong Ltd. 7th Floor, North Tower, World Finance Centre, Harbour City, 1 Canton Road, Tsimshatsui, Kowloon, Hong Kong Tel: <852> 2265-6688, Fax: <852> 2730-6071 Renesas Technology Taiwan Co., Ltd. 10th Floor, No.99, Fushing North Road, Taipei, Taiwan Tel: <886> (2) 2715-2888, Fax: <886> (2) 2713-2999 Renesas Technology Singapore Pte. Ltd. 1 Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632 Tel: <65> 6213-0200, Fax: <65> 6278-8001 Renesas Technology Korea Co., Ltd. Kukje Center Bldg. 18th Fl., 191, 2-ka, Hangang-ro, Yongsan-ku, Seoul 140-702, Korea Tel: <82> (2) 796-3115, Fax: <82> (2) 796-2145
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(c) 2006. Renesas Technology Corp., All rights reserved. Printed in Japan.
Colophon .7.0


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